Effect of alloying elements addition on mechanical and electrical properties of lead free solder alloys

Eutectic Sn-Zn solder alloy is currently considered as major lead–free replacement candidates for Sn-Pb eutectic alloys in microelectronics applications. In this thesis, four solder alloys were synthesized by adding minor addition of x-Sb, (x = 0.45, 0.85The microstructure investigations showed that, the permanent phases formed within the matrix of the four alloys during solidification are namely, -Sn, and eutectic phase of (Sn-Zn). The presence of Sb stimulates to form the intermetallic compound (IMC) S